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        Piezoelectric Valve Jetting SystemKPS2000

        KPS2000 series piezoelectric jetting valve is a new generation of high-speed, precision and non-contact jetting system which can deal with low, medium, high and ultra-high viscosity media; configurations such as UV type, corrosion-resistant type, PUR type and anti-corrosion type are available according to different application media.

        Features and Advantages Features and Advantages

        Stable and Consistent Dispensing

        The tappet guide seat is directly connected with the runner thread, and the coaxial and guiding design of the guide seat and the runner is added; the coaxiality of the tappet and the nozzle is improved to ensure continuously stable dispensing.

        The jet force of the valve body is increased by 20%, and higher-viscosity glue (up to 500000cps) can be supported.

        Parameter Quantification Control Ability

        The scale quantification of adjustment components is increased, and the adjustment amount per scale is 0.01mm.

        Faster Process Recovery Capability

        Auxiliary enhanced version of ADJ calibration function and repeatability of 0.01mm.

        After routine cleaning and assembly, jetting can be done directly without ADJ calibration, and the process recovery time is less than 2 minutes.

        Lower Usage Costs

        With integrated design of nozzle seat, 1 sealing ring + 1 nozzle sealing seat + 1 installation tool are reduced to decrease maintenance and usage costs.

        Application Fields Application Fields

        • Acoustics
        • Optics
        • Medical
        • New Energy Battery
        • Semiconductor
        • Automotive Electronics
        • Flexible Circuit Board
        • Display Screen

        典型應用 典型應用

        • Wafer Level Packaging
        • Corner and Edge Connection
        • Package on Package (PoP) Underfill
        • Flip Chip (FC ) Underfill
        • Surface Mount
        • Voice Coil Motor (VCM) and Vibration Motor
        • Ball Grid Array (FC BGA) and Chip Scale Packaging (FC CSP) Underfill
        • Compact Camera Module (CCM)(CCM)
        • Dam & Fill
        • Micro Speaker and Micro Receiver
        • High-Density Printed Circuit Board (PCB) Underfill
        • Conductive Epoxy Resin

        Applicable Fluids Applicable Fluids

        • Epoxy Glue
        • Silica Gel
        • Silver Glue
        • UV Glue
        • Corrosive Glue
        • Ink
        • PUR Adhesive
        • Silica Gel Corrosive Glue
        •  Flux 
        •  Red Adhesive 
        •  Silver Glue 
        •  Ink
        • Thermosetting Adhesive
        • Red Adhesive
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